September 28, 2021
IMAPS-UK’s IPower3 Conference on Electronic Packaging for Net Zero will take place at the Advanced Propulsion Centre at the University of Warwick, near Coventry in a face […]
August 18, 2021
MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble (France) from 10 to 11 March, 2022. MiNaPAD is a 2-days […]
August 18, 2021
Following the success of the Power Electronics Workshop organized over the past 11 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM and Polytech […]
August 18, 2021
The 54th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The Symposium will feature 5 technical tracks, plus our Interactive Poster […]
August 18, 2021
A group of university teachers led by the Speaker has been working on various types of web-based education materials for many years. These materials are more […]
August 18, 2021
The European Microelectronics and Packaging Conference (EMPC) 2021 offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this […]
October 30, 2019
The 53rd International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS). The IMAPS 2020 Technical Committee seeks original papers […]
October 30, 2019
The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two […]
October 29, 2019
The International Conference and Exhibition on Thermal & Power Solutions specifically addresses current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge […]
October 29, 2019
HiTEC 2020 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under […]
October 28, 2019
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]
October 9, 2019
MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC Congress Center from 27 to 28 May, […]