The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS Europe. This international event brings together both academics and industry leaders to present and discuss the state-of-the-art as well as the future trends in electronics packaging and integration technologies. ESTC offers excellent opportunities for knowledge exchange and networking with international experts in the field.
The ESTC 2020 seeks original, non- commercial papers describing research and innovations in all areas of electronics packaging and system integration. Abstracts should present new developments and knowledge in areas such as:
You are invited to submit a 300-500 word abstract that describes the scope, content and key points of your proposed paper. Submission of abstracts is opened from 1st December 2019 and is closed by 16th February 2020. All abstracts must be submitted electronically on the conference website.
Registration as exhibitor:
ESTC 2020 provides you a unique opportunity to exhibit your products and/or services to around 300 engineers and managers from all areas of the microelectronics, microsystems and system integration industry. To meet the audience’s interests best, the exhibition will be arranged thematically, such as materials and processes for semiconductor packaging, assembly and interconnect technologies, test and characterization equipment, simulation and software tools, wafer post-processing services and market research. If you are interested in ordering a booth, please contact the exhibition co-chairs Ole-Henrik Gusland or Hoang-Vu Nguyen at firstname.lastname@example.org.