October 9, 2019
The 15th Advanced Technology Workshop on Micropackaging and Thermal Management will be held in La Rochelle from 5 to 6 February, 2020. The Workshop will present […]
August 19, 2019
The 16th Annual Device Packaging Conference (DPC 2020) will be held in Fountain Hills, Arizona, on March 2-5, 2020. The conference is a major forum for […]
August 19, 2019
The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop in San Diego on Advanced Packaging for Medical Microelectronics on January 28-29, […]
August 19, 2019
The International Microelectronics Assembly and Packaging Society (IMAPS) will host a Topical Workshop on Additive Manufacturing and Printed Electronics on September 30, 2019, preceding IMAPS 2019 […]
August 19, 2019
Following the success of the Power Electronics Workshop organized over the past 10 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics, CERTeM […]
August 19, 2019
Microlectronics Packaging for Harsh Environments is an IMAPS-UK technical conference covering the latest developments for microelectronic devices used in space, defence, aerospace, medical, energy & exploration […]
August 19, 2019
Every year in autumn IMAPS Germany organizes its annual conference on current topics of assembly and connection technology in all fields of application. In order to […]
August 19, 2019
The 5th IMAPS flash Conference 2019 will be held from October 24th to 25th, 2019 at Brno University of Technology (FEEC, Department of Microelectronics). The conference […]
August 19, 2019
The 43rd IMAPS Poland Conference 2019 will take place at the Conference Centre of Wrocław University of Science and Technology from September 4th to 6th, 2019. […]
March 28, 2019
The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development […]
March 28, 2019
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 22-23, 2019. MiNaPAD […]
December 13, 2018
The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the […]