MiNaPAD, the “Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum” will be held in Grenoble, France, at the WTC Congress Center from 27 to 28 May, 2020.

MiNaPAD is a 2-days conference with an exhibition. The objective of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community.

Abstracts are requested on the following topics:

  • Advanced Packaging
  • CAD and tools for I/O placement for advanced packaging
  • Digital deep submicron technologies for scaling nodes, MEMS, sensors, actuators, RF miniaturization, smart system packaging and heterogeneous integration
  • Innovative packaging for emerging and growing applications
  • Materials
  • Emerging technologies and novel approaches
  • Assembly manufacturing
  • Reliability, wear out, test and characterization
  • Advanced interconnections

Please send your abstract (350 words minimum, one page maximum) to this email address until 31 January, 2020: imaps.france@imapsfrance.org.

If you would like to participate as an exhibitor at MiNaPAD 2020, you will find all necessary information here.


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