The European Microelectronics and Packaging Conference (EMPC) 2021 offers the best of microelectronics packaging and interconnection technologies, providing top quality coverage of technological innovation in this field. In the present circumstances with the Covid 19 situation the EMPC 2021 will be held online from September 13 to 16, 2021. In addition to our program, we will organise break-out rooms that are accessible for mingling and networking during breaks and lunches.

The program includes three fantastic short courses on the 13^th;

• MEMS Sensors and Actuators, by Prof. Gabor Harsanyi
• Implications of New Semiconductor-Trends for IC-Packages, by Tanja Braun and Michael Töpper
• Achieving High Reliability of Lead-Free Solder Joints – Materials Considerations, by Ning-Cheng Lee

The actual conference and exhibition starts on the 14^th and will focus on the following topics:

• Advanced Packaging
• Advanced packaging for MEMS & sensors
• Electronics Reliability & Quality
• Green Technologies
• Harsh environment applications
• Materials & Processes
• Medical electronics
• Opto-electronics
• Power electronics
• Printed electronics

On the 14^th, you will also be able to see some of our sponsors and exhibitors present their line of products and services. Please register now to be part of this exciting conference!