Thermal & Power Solutions 2020

The International Conference and Exhibition on Thermal & Power Solutions specifically addresses current market needs and corresponding technical developments for electronics thermal management. Presentations on leading-edge developments in thermal management components, materials, and systems solutions for effectively dissipating heat from microelectronic devices and systems are sought from industry and academia. The Workshop emphasizes practical, high-performance solutions that target current and evolving requirements in mobile, computing, telecom, power electronics, military, and aerospace systems. Single-company product development concepts are acceptable subjects; however, all abstracts will be judged on their novelty and innovative contributions to the industry knowledge.

Abstracts are solicited in the following areas:

Market Drivers
Multi-Die Packaging
Mobile and Handheld Devices and the Internet-of-Things (IoT)
Wireless and Telecom Infrastructure
Power Semiconductor Thermal Components, Systems, and Solutions
Military/ Aerospace
System-Level Cooling
Data Center Cooling
Liquid cooling, Phase-change, and Refrigeration
Thermal Interface Materials (TIMs) and Testing
CTE-Matching and High Thermal Conductivity Materials

Those wishing to present at the conference must submit a 500+ word abstract electronically until December 6th, 2019 using the online submittal form at: http://www.imaps.org/abstracts.htm.

New this year – a technology cross-over extravaganza! CICMT, HiTEC and Thermal & Power Solutions come together for a great opportunity for you: one location, one registration and three times the content, networking, and learning!