ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]

MPACT 2018 Conference, organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year, it will […]

the 17th international Symposium on Microelectronics and Packaging (ISMP 2018) will be held at COEX convention center, Seoul, Korea, on October 24-26, 2018. This international conference […]