September 17, 2018

Thermal 2019

The Workshop will present improvements in thermal management materials, components and systems, to provide innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and sub-systems. […]
September 17, 2018

Power 2018

Following the success of the Power Electronics Workshop organized over the past 9 years in partnership with GREMAN (UMR 7347) and Polytech-Tours, sponsored by ST-Microelectronics and éolane, IMAPS-France […]
September 16, 2018

ICEP 2019

ICEP is the largest international conference on electronic packaging in Japan, attracting more than 360 attendees and hosting about 35 technical sessions. ICEP provides a strong […]
September 16, 2018

IMPACT 2018

MPACT 2018 Conference, organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA, is the largest gathering of packaging and PCB professionals in Taiwan. This year, it will […]