The Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) conference brings together a diverse set of disciplines to share experiences and promote opportunities to accelerate research, development and the application of ceramic interconnect and ceramic microsystems technologies. This international conference features ceramic technology for both microsystems and interconnect applications. The committee is planning sessions and inviting speakers on the following topics:

1. Functional materials for passive/active devices and their properties
• Microwave/mm-wave LTCC/ULTCC dielectric materials
• Ferroelectric/piezoelectric/pyroelectric/ferrite/multiferroic materials
• Sensitive ceramics/thermoelectric/electrocaloric materials
• Dielectric/ferroelectric/piezoelectric composites
• Pastes/inks/slurries for electronics

2. Material processing and device manufacturing technologies
• LTCC/HTCC and multilayer ceramic and glass processing
• Emerging ultralow temperature, room temperature processing, and cold sintering processing
• Additive manufacturing /3D printing/ direct writing
• Advanced thick film processing
• Fine structuring technologies
• Emerging embedding/integration technologies

3. Devices for emerging technologies
• Circuits, antennas, and filters for MHz, GHz and THz for communications
• Automotive/aerospace/medical electronics/optoelectronics
• Flexible/wearable electronics
• Integrated physical/chemical/biological sensors and actuators
• Packaging and integration issues for MEMS and BioMEMS devices
• Batteries/fuel cells/ energy conversion systems
• Micro-reactors/micro-fluidic devices

4. Design, modeling, simulation, characterization and reliability
• Metamaterials design, realization and characterization
• High frequency devices design/modeling/simulation
• Materials and devices characterization
• Material and device reliability, lifetime, and failure estimation
• Thermal management/thermal transfer simulation

Those wishing to present at the conference must submit a 500+ word abstract electronically until December 6th, 2019 using the online submittal form at: http://www.imaps.org/abstracts.htm.

New this year – a technology cross-over extravaganza! CICMT, HiTEC and Thermal & Power Solutions come together for a great opportunity for you: one location, one registration and three times the content, networking, and learning!